What can be the consequence of using dirty surfaces during soldering?

Using dirty surfaces during soldering can lead to poor adhesion between the solder and the materials being joined. The presence of contaminants such as oil, oxidation, dust, or other residues can inhibit the ability of the solder to properly flow and bond to the surfaces. This lack of proper adhesion can result in weak joints that may fail under stress, heat, or during operation.

A clean surface is crucial for achieving effective soldering, as it allows for the solder to wet the metal properly, ensuring a strong and reliable joint. Without proper bonding, the integrity of the connection is compromised, which can lead to failures in electrical connectivity or structural support, making it essential to ensure surfaces are clean before beginning the soldering process.