What is a key difference between a solder joint and a braze joint?

The distinction of a solder joint being primarily used for electronics is rooted in the properties of solder itself and the applications it is best suited for. Solder, which is generally a tin-lead or lead-free alloy, has a relatively low melting point, typically around 180 to 230 degrees Celsius (356 to 446 degrees Fahrenheit). This makes it ideal for joining electronic components, such as circuit boards and small electronic devices, without risking damage to sensitive parts due to thermal expansion or excessive heat.

Conversely, brazing involves higher temperatures and is utilized for stronger joints in applications that require greater mechanical strength and durability. Hence, while soldering is preferred for more delicate electronic tasks, brazing is often employed in plumbing, HVAC systems, and other metalworking situations where a strong, permanent joint is essential. The application focus of solder in electronics explains the correctness of identifying it as primarily associated with this field.