What is a potential result of thermal cycling on solder joints?

Thermal cycling refers to the process of repeatedly exposing solder joints to varying temperatures, which can lead to expansion and contraction of the materials involved. This repeated stress can cause fatigue in the solder joints, ultimately increasing the risk of fatigue failure. As the temperature fluctuates, the differential expansion between the solder and the substrate can create mechanical stress. Over time, this stress can accumulate and lead to cracks or complete failure of the solder joint, particularly in applications subjected to harsh environments, such as electronics and automotive systems.

Improved stability or better resistance against stress is generally not a result of thermal cycling; instead, it tends to have the opposite effect due to the repeated mechanical strain. Similarly, stating that there is no significant impact disregards the well-documented issues associated with thermal fatigue in solder joints. Therefore, the identification of increased risk of fatigue failure as a consequence of thermal cycling accurately captures the potential negative effects on solder joints.