What is the main consequence of undercutting in soldering?

Undercutting in soldering refers to the removal of material beneath the surface of the joint, which creates a groove or ledge. This can significantly weaken the overall bond between the solder and the workpieces because it reduces the surface area that is actually in contact with the solder. When the bonding surface area is diminished, the ability of the solder joint to hold together under stress is compromised, resulting in insufficient bonding strength.

This phenomenon can occur due to various factors, including excessive heat, improper technique, or poor solder flow. When solder flows away from the intended joint area, it not only affects the mechanical strength of the joint but also may lead to potential failure under operational loads. Understanding the risks associated with undercutting is crucial for achieving strong and reliable solder joints in any soldering application. This underscores why insufficient bonding strength is the main consequence of undercutting in soldering.