What process is used in making both soldered and brazed joints?

The process of flowing filler metal through capillary action is essential in both soldering and brazing. In these methods, a filler metal is heated to a temperature above its melting point and is then drawn into the joint between two base metals. This occurs due to capillary action, where the filler metal flows into the narrow spaces created by the surface gaps of the materials being joined.

In soldering, the filler metal is often a tin-lead alloy, which melts at a relatively low temperature, typically below 450 degrees Celsius. For brazing, the filler metal has a higher melting point, usually above 450 degrees Celsius, often using materials such as silver or copper alloys. The effectiveness of these processes hinges on the ability of the molten filler metal to infiltrate the joint area through capillary action, ensuring a solid bond once it cools and solidifies.

Other methods mentioned, such as heating to low temperatures, using adhesive compounds, or pressure welding techniques, do not adequately describe the mechanism that ensures a strong, effective bond in soldered and brazed joints. The focus on capillary action highlights the importance of the combination of heat and fluid dynamics in achieving successful joining in these processes.