Which materials are commonly used as filler metals in soldering?

The choice of lead-tin alloy and silver solder as filler metals in soldering is appropriate due to their widespread use and effectiveness in joining metals. Lead-tin alloys have traditionally been favored for electronic soldering applications because of their low melting point and excellent wetting properties, which allow them to flow easily and create strong bonds. Silver solder is often utilized in applications requiring higher strength and better thermal or electrical conductivity, making it ideal for joining a variety of metals, including those found in plumbing and jewelry making.

These materials not only provide reliable joints but also facilitate the melting and bonding processes that are characteristic of soldering. The ability to easily melt and allow for sufficient capillary action goes hand in hand with the objectives of soldering, which seeks to achieve a strong metallic bond while minimizing thermal damage to the components being joined.

Other materials listed are less commonly used as filler metals in soldering. Gold and copper, while important in different contexts, are not typically used as filler metals in the same way. Aluminum and brass are not practical for soldering due to their higher melting points and the complications involved with achieving a strong bond without special techniques. Steel and titanium are more frequently associated with welding processes rather than soldering, which is focused on lower-temperature